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Atomic Layer Etching as a Scaling Enabler: From Isotropic Chemistry to...
Continued scaling in semiconductor manufacturing increasingly relies on atomic-scale control of etching for complex 3D material stacks, making patterning precision a growing industrial bottleneck....
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Intel Foundry Advances Future Logic Scaling with Manufacturable 2D...
Intel Foundry has demonstrated concrete momentum in de-risking 2D field-effect transistors as a future scaling path beyond silicon, through long-term collaboration with Imec. Results presented at IEDM...
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Nanexa and Moderna partner on ALD-based PharmaShell drug delivery platform in...
Nanexa and Moderna have entered into a license and option agreement covering the development of up to five undisclosed drug compounds using Nanexa’s PharmaShell® drug delivery platform. The agreement...
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Capacitive memory built on a TSMC CMOS chip (reported in Nature)
Researchers led by Junmo Lee from Georgia Institute of Technology in collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) have demonstrated a new type of capacitive memory integrated...
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The 2026 Area Selective Deposition Workshop (ASD 2026)
The ASD Workshop was initiated in 2016 to provide a scientific communication channel to learn and exchange about selective deposition techniques. It has since offered a forum for open discussions...
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Samsung Researchers Achieve Near-Perfect Grain Orientation in Atomic Layer...
Researchers at the Samsung Advanced Institute of Technology (SAIT) have unveiled a breakthrough in interconnect materials at IEDM 2025 with their paper “Grain-Orientation-Engineering of Atomic Layer...
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IEDM2025 Tutorial - Atomic layer deposited atomically thin In₂O₃ transistors...
The IEDM 2025 T3 tutorial session titled “Atomic-layer-deposited atomically thin In₂O₃ transistors for BEOL logic and memory applications” will focus on recent progress in oxide semiconductor thin-film...
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Applied Materials Deepens Partnership with Besi and Launches Kinex™ – the...
Applied Materials announced it has acquired a 9% stake in BE Semiconductor Industries (Besi) to strengthen their ongoing collaboration on hybrid bonding technology for advanced semiconductor packaging....
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Plasma-Based Deposition Refines ALD for Next-Gen DRAM: 30% Higher k, 40×...
Researchers from POSTECH and UNIST in Korea have unveiled a new atomic-layer process using plasma-based deposition (PDP) to significantly improve DRAM capacitors. This innovation addresses a critical...
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AlixLabs presents HAR narrow-fin patterning at ECS 248
AlixLabs is pleased to announce that Dr. Dmitry Suyatin, CIPO and Co-Founder, has presented the company’s latest advances in APS™ (Atomic Layer Etching Pitch Splitting) at the 248th Electrochemical...
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ASM Charts the Future of ALD: Scaling Innovation, Integration, and...
ASM used its 2025 Investor Day to set a bold 2030 ambition of more than €5.7 billion revenue, operating margins above 30%, and free cash flow above €1 billion. The company has consolidated a leading...
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JSR, Lam Research, and SK hynix Push the Boundaries of ASML´s EUV...
JSR Corporation, including its subsidiary Inpria Corporation, and Lam Research have entered into a cross-licensing and collaboration agreement to accelerate the development of next-generation...
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Breaking the Copper Bottleneck: Lam Research’s Mo-ALD ALTUS Halo Enables...
Lam Research now offers molybdenum (Mo) atomic layer deposition (ALD) with its ALTUS Halo platform, introduced in 2025 as the first high-volume ALD tool designed for Mo metallization. The system...
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ALD News Week 38
Solid-state batteries get a boost with new protective coating Link: https://www.anl.gov/article/solidstate-batteries-get-a-boost-with-new-protective-coating“A thin, glass-like layer could help protect...
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Global Semiconductor Sales Surge 20.6% in July, Driven by Americas and Asia...
Global semiconductor sales surged in July 2025, reaching $62.1 billion — a 20.6% increase from the same month last year and 3.6% higher than June. The robust expansion was fueled by strong demand in...
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EU Expands Dual-Use Export Controls to Cover Atomic Layer Deposition, Etch,...
On 8 September 2025, the European Commission adopted a Delegated Regulation updating the EU’s dual-use export control list (Annex I of Regulation (EU) 2021/821). The update aligns EU rules with...
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TSMC’s 2 nm Fabs Lock Out China OEMs, Securing ALD and Process Tool Demand...
TSMC’s decision to exclude Chinese equipment vendors from its 2 nm fabs in Taiwan and the US reshapes the competitive landscape in favor of Japanese, American, and European suppliers. With the 2 nm...
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Chipmetrics expands metrology portfolio with advanced test chips and wafer...
Finnish metrology specialist Chipmetrics has expanded its portfolio with a new range of advanced test chips and wafer solutions aimed at accelerating prototyping and enhancing precision in...
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Shaping the Future of Thin Films: New Trends in Thermal ALD Chemistry
A new review published in the Journal of Vacuum Science & Technology A takes a detailed look at recent developments in thermal atomic layer deposition (ALD) chemistry, drawing on data from the...
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Beneq Secures Repeat Orders as ALD Gains Ground in MicroLED Display Market
Espoo, Finland, 14 July 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) technology, has announced significant momentum in the microLED display sector, marked by repeat orders from...
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