MORRISVILLE, Pa., July 27, 2018 — Semiconductor material Gelest Inc. has announced the commercializing of diiodosilane to meet the global demand of the semiconductor industry for next-generation semiconductor chips.
Diidosilane (LINK)
Gelest’s dedicated diiodosilane plant in Morrisville is fully operational and can produce commercial quantities of diiodosilane with purity in excess of 99.9 percent. Diiodosilane is a key chemical precursor used by semiconductor companies worldwide in the development and scale-up of next-generation semiconductor chips that require high-throughput, highly conformal silicon nitride thin films.
Diiodosilane is typically deposited by plasma-enhanced atomic layer deposition to create the silicon nitride thin film. Gelest sees a significant increase in demand for high purity diiodosilane driven by development and production of semiconductor chips requiring silicon nitride thin films at low thermal budgets.
Gelest is a manufacturer of specialty materials for the semiconductor industry.
Diiodosilane is typically deposited by plasma-enhanced atomic layer deposition to create the silicon nitride thin film. Gelest sees a significant increase in demand for high purity diiodosilane driven by development and production of semiconductor chips requiring silicon nitride thin films at low thermal budgets.
Gelest is a manufacturer of specialty materials for the semiconductor industry.
Source : Photonics LINK
Gelest is sponsoring and exhibiting at the AVS ALD2018 conference currently taking place in South Korea (LINK)
