Rémi Maillat's Watch Brand Launches €145,500 Titanium Timepiece with...
The watchmaker founded by Rémi Maillat in 2017 reveals its deep connection with nature with a bold monochromatic titanium timepiece. The spiral dial motif is covered in a shade of green, inspired by...
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Kokusai Electric Showcased Batch ALD Technology for 40-28nm Nodes at SEMICON...
At SEMICON China 2024, Kokusai Electric Corporation emphasized its strengths in atomic layer deposition (ALD) technology. The company showcased its batch-type ALD systems, which are particularly adept...
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Apple Partners with Taiwanese Largan to Advance iPhone Camera Plastic Lenses...
Apple is exploring the potential of replacing the glass lenses in future iPhone cameras with advanced plastic lenses that have successfully passed customer testing. Two years prior, Apple's supplier...
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Hanwha to supply ALD Equipment for Molybdenum Deposition for Memory Applications
According to Korean media, Hanwha Precision Machinery is developing a new type of thermal atomic layer deposition (ALD) equipment for depositing molybdenum, which is emerging as a superior material for...
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SK hynix to Lead in Advanced DRAM Production, Overtaking Samsung with Earlier...
Korean SK hynix is set to initiate mass production of its advanced 6th generation 10nm class DRAM (node 1c) in the third quarter of this year, ahead of its competitor Samsung Electronics. The move...
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A New Zr Precursor Enhances Wafer-Scale Zirconium Dioxide Films
A new class of Zirconium (Zr) precursor, featuring boratabenzene ligand, has been developed by a team led by Mohd Zahid Ansari at Yeungnam University, enabling the production of highly conformal ZrO2...
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Ahead of the 50 Years of ALD celebration in Helsinki, learn about the...
The AVS ALD Conference is the main event for those in Atomic Layer Deposition. The 3-day meeting rotates between the US, Europe and Asia, chock full of interesting parallel sessions, an industry...
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Intel's Strategic Leap with 14A Node and DSA: Pioneering Next-Gen...
Semi Analysis recently published a deeper dive into of Directed Self Assembly (DSA) and prospects of Intel using it at their 14A node (Link below). Intel's latest efforts in semiconductor manufacturing...
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Linköping University Researchers Pioneer the Synthesis of 'Goldene - a...
Researchers form Linköping University, Sweden, publish a novel method for synthesizing "goldene," a monolayer of gold, achieved by etching away Ti3C2 from a nanolaminated Ti3AuC2 structure using a...
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Samsung Sets New Industry Standard with 290-Layer V9 NAND employing mutli...
Samsung Electronics has initiated mass production of its 9th-generation 1Tb TLC vertical NAND (V-NAND), marking a significant advancement in memory technology. This new generation features the...
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ASM a revenue of €639 million Q12024 - driven significantly by sales in...
Here are the key points from ASM International NV's financial results for the first quarter of 2024:The company reported a revenue of €639 million, at the upper end of their guidance, driven...
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Fundamentals of ALD course – 6-7 June 2024, University of Bath, UK
The "Fundamentals of ALD" course, scheduled for June 6-7, 2024 at the University of Bath, UK, targets newcomers and professionals seeking to deepen their understanding of atomic layer deposition (ALD)....
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Jusung Engineering to Spin Off Semiconductor Business, Aiming for Market...
Jusung Engineering, a a first in Korea’s chipmaking equipment industry, has announced a significant restructuring aimed at enhancing its market valuation and navigating geopolitical risks. The company...
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NCD Co., Ltd. has supplied ALD equipment for manufacturing perovskite solar...
NCD Co., Ltd. has recently supplied KEPCO Research Institute (KEPRI) with its dedicated ALD equipment (Lucida GS-P360) for perovskite solar cells (PSCs). This is equipment for depositing SnO2 thin...
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Air Liquide signed major contract to support the semiconductor industry in...
Air Liquide has announced a significant investment exceeding $250 million to construct a new industrial gas production facility in Idaho, USA. This plant will supply ultra-pure nitrogen and other...
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ASML Unveils Hyper-NA EUV: Pioneering New Frontiers in Chip Innovation and...
ASML, the leader in lithography technology for semiconductor manufacturing, has launched its latest breakthrough: the Hyper-NA EUV tool and Intel being the first customer getting its first machine...
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Boosting the Future: Increased ALD Use Paves the Way for Advanced GAAFET...
The Biden administration is considering a complete ban on the export of chips utilizing Gate All-Around Field Effect Transistor (GAAFET) technology to China, Bloomberg reports (LINK). The rationale...
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Chipmetrics' Metrology Workshop
This exclusive workshop provides opportunity to learn about Angstrom scale metrology of ALD thin films in ultra High Aspect Ratio structures. In addition, it gives insights of most advanced rapid...
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Tokyo Electron Introduces Acrevia Tool to Enhance EUV Lithography
Tokyo Electron has introduced Acrevia, a state-of-the-art gas cluster beam (GCB) system aimed at refining patterns created by EUV lithography. This advanced tool is set to reduce the necessity for EUV...
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Chipmetrics Launches New Test Chips for Advanced Atomic Layer Processes
Finnish 3D thin film semiconductor metrology specialist launches new PillarHall LHAR5 test chip with 100 nanometer gap height, complements its metrology solution with new ASD-1 chip for Area Selective...
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